Remtec was established in 1990 to serve a need in advanced ceramic packaging technology for the electronics industry, primarily for high-power and circuit density applications covering a broad frequency range. The company developed plated copper on to thick film ceramic metalization technology to meet this need. It has been involved in the design and fabrication of metalized ceramic boards, chip carriers, packages and specialty components for various electronic applications. In 1999, the company acquired a plating company with new equipment, including an automated cassette-to-cassette production line, which allowed it to position itself as one of the leading manufacturers of PCTF substrates, chip carriers, packages and specialty components. Remtec is headquartered in Norwood, Mass.