Doylestown / Pennsylvania / United States
International Wireless Industry Consortium is an international community of Original Equipment Manufacturers of wireless products and its suppliers. It facilitates the communication between supply chains to reduce costs, improve performance and decrease the time of marketing. The consortium aims at decreasing the packaging knowledge gap between OEMs and suppliers. It informs companies about new and alternate packaging technologies. International Wireless Industry Consortium also emphasizes interconnect technologies and helps suppliers in learning about the technical and business needs of manufacturers and make development investments. It additionally assists manufacturers in knowing the innovations made by suppliers so that they consider them on their product development roadmaps. The consortium offers packaging services for various devices, such as design tools, raw materials, shielding, systems, and active and passive device technologies. Located in Warminster, Pa., its members include IBM, ADC Telecommunications, Comba Telecom, Emerson & Cuming and Huawei Technologies.
